lapping vf700alcu a good idea?
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lapping vf700alcu a good idea?
Would lapping the vf700alcu would improve temps, or just be a waste of time?
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Re: lapping vf700alcu a good idea?
I don't have a VF700, yet, but I've had quite a few Zalman's 7000's. Considering the base finish I've seen of their heatsinks, I don't think you could do better by lapping it. Most GPU's aren't incredibly flat, any way, so making the heatsink more flat, probably won't gain you much, if anything.jamesm wrote:Would lapping the vf700alcu would improve temps, or just be a waste of time?
Re: lapping vf700alcu a good idea?
I would vote for waste of time. My all copper unit came out of the package as close to mirror finish as I would want.jamesm wrote:Would lapping the vf700alcu would improve temps, or just be a waste of time?
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You can lap cpus. The very top part of it doesn't contain the silicone necessary for the chip. It's very risky but some overclockers are willing to take the risk for that extra degree.frankgehry wrote:So even if the heatsink is flat as determined with a straight edge and smooth you recommend lapping? What if the cpu itself is not flat? What then?
You have to lap both cpu/gpu AND heatsing.
It's A LOT of work (2-3 hours for both) and all you can gain is 2-3 degrees (of course YMMV).
It's more practical to get rid of stock chewing gum like thermal pad only, then clean your cpu/gpu and apply the best thermal compound you can get. It is 15 mins job and it will get you also 2-3 degrees lower temps.
Of course lapping + better thermal compound its even better. But it is not 3 deg. from lapping PLUS 3 deg. from thermal compound gain - you can get max 4 deg. lower temps if your heatsink was really rough and you had lousy bubble gum thermal pad.
It's A LOT of work (2-3 hours for both) and all you can gain is 2-3 degrees (of course YMMV).
It's more practical to get rid of stock chewing gum like thermal pad only, then clean your cpu/gpu and apply the best thermal compound you can get. It is 15 mins job and it will get you also 2-3 degrees lower temps.
Of course lapping + better thermal compound its even better. But it is not 3 deg. from lapping PLUS 3 deg. from thermal compound gain - you can get max 4 deg. lower temps if your heatsink was really rough and you had lousy bubble gum thermal pad.