Standard Thermal Tape on GPU MOSFETs or MX-2 paste?

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Standard Thermal Tape on GPU MOSFETs or MX-2 paste?

Post by Sainty » Tue Aug 28, 2007 1:16 am

New computer building time!

Worklog here:

Thermal Paste to be used in rig:

This paste has won several awards, even supposedly topping the excellent AS5. Be that as it may, one of the reasons I went with it is that it does NOT contain any metals in it, making it safe for use around tight spots where leads or other nasties might get in the way. Suffice it to say it sounds like a dummy proof goop.

After reading several articles suggesting that you can seriously reduce your GPU temps by applying after-market thermal paste I decided to open up my MSI 8800 GTS 640 Overclocked Edition:


As you can see from the picture, there's the standard gray thermal paste on the GPU core itself, plus there's small slabs of a thermal paste tape on the card's MOSFETs. I took the tape off just to see what it was make out of and it appears to be a fibrous and creamy texture.


While most modders highly recommend putting the after-market goop on the GPU core, I've heard little about putting a non-conductive paste like MX-2 directly on the MOSFETS. My real question is, do you think it is best to use the standard tape gunk that came with the card or should I lather on a swab of MX2 for each of the chips? Has anyone tried this before?

As you can see from the product page, the MX2 is non-corrosive, non-conductive and non-capacitive. By all accounts it should be fine, correct? If so, do you think I should apply approximately the same amount of gunk to match what MSI had or did they use too little/much? Thanks for your input.

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Post by Das_Saunamies » Tue Aug 28, 2007 3:26 am

Usually the tape is there because the gap is too great to fill with a paste. I'd leave the tape in as-is if that is the case, it's not really that good but may be all the chips need.

If you have the option of cleaning the chips up and applying your TIM, I'd go for it. Probably needs very little if it spreads as well as AS does under pressure. Most thermal pads and tape I've seen are excessive in contact area and thickness, probably because of production tolerance reasons.

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