TIM application on Direct Heatpipes

CallMeJoe · Post by **CallMeJoe** » Fri Jan 18, 2008 6:03 pm

I got my Kingwin RVT-12025, and will be mounting it this weekend. I was looking at the base, and wondered if I should do anything different in my TIM application. I favor the "dollop" method in general, but am unsure about this instance. There are small voids in the base between the heatpipes and the aluminium insert. I am debating whether to try to fill them before mounting the HSF, or just place my dollop of TIM on the (lapped) IHS and let it try to spread up into the voids. I am also considering which TIM to use; have my choice of AS5, AS Ceramique, or Shin Etsu G-751 (my most likely selection).

Any thoughts?

Das_Saunamies · Post by **Das_Saunamies** » Sat Jan 19, 2008 4:13 am

What does their manual say?

CallMeJoe · Post by **CallMeJoe** » Sat Jan 19, 2008 7:53 am

The instruction sheet reads "apply thermal grease evenly to the bottom of heat sink base". I am, however, inclined to spread the Shin Etsu across the base to fill the voids, removing the excess with a flat edge, then applying a dollop to the IHS before seating the heatsink.

JimX · Post by **JimX** » Sat Jan 19, 2008 9:15 am

Crossposting, heh?

Just do it the usual way, if it gets hot, then think about other options.