A simpler way to achieve the same -- or even better -- cooling performance would be to delid the CPU and use a flat or lapped base heatsink. You'd need to make sure the heatsink mounting is done in an even, consistent way to avoid crushing edges or corners of the exposed die, but that die surface is mirror flat. Most of the good through-the-board bolt mounting systems would be fine for this. Of course, this is easiest done with CPUs where the IHS is not soldered but TIM-ed, tho it's possible to do with the former if you heat it up nicely with a hair dryer or heat gun and are willing to clean up the solder gunk underneath. (There's probably standard solutions for solder cleanup.)kevith wrote:Yeah, kind of like that. If two surfaces has to fit each other real tight, that´s the way to go.
Regarding practicality, it probably isn´t... Both parts would have to be fixated - unless you have a very steady hand - as you polish, which requires some thinking and tinkering, and when you´re finished, these two parts will be forever "married until death do them part".
But if you actually succeeded, I think it might give an extra degree or two. The ideal scenario is the two surfaces fitting so snugly together, that they don´t need no TIM. That´s impossible in the real world, where we pay for things with real money, though, but a polish like this might get us a little closer.
But having said all that, unless you're oc'ing to the bleeding edge & need every cooling advantage, I really don't see the need for users to go to such trouble. The best heatsinks around (either convex or flat base) are perfectly capable of cooling the hottest CPUs, especially if super low noise is not a high priority.