check out my heatsinks
Moderators: NeilBlanchard, Ralf Hutter, sthayashi, Lawrence Lee
check out my heatsinks
A
B
C -is in development-
input? think you could do better? show me.
for the people interested... Im taking pre-orders
B
C -is in development-
input? think you could do better? show me.
for the people interested... Im taking pre-orders
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jaganath wrote:"superconductive" heatpipes? AKAIK only superfluids superconduct heat and you need cryogenic temps for that.
Patent no. 6,132,823
Superconducting Heat Transfer Medium
http://patft.uspto.gov/
Inorganic Medium Thermal Conductive Device. This heat conducting device greatly improved the heat conductive abilities of materials over their conventional state. Experimentation has shown this device capable of transferring heat along a sealed metal shell having a partial vacuum therein at a rate of 5,000 meters per second.
On the internal wall of the shell is a coating applied in three steps having a total optimum thickness of 0.012 to 0.013 millimeters. Of the total weight of the coating, strontium comprises 1.25%, beryllium comprises 1.38%, and sodium comprises 1.95%....
The fact that a conventional heat pipe shares a similar outside shape to a thermal superconductive heat pipe used to raise some misunderstandings. Therefore, it is necessary to give a brief description on the differences and similarities of the two. A convectional heat pipe makes use of the technique of liquids vaporizing upon absorbing great amounts of heat and vapors cooling upon emitting heat so as to bring the heat from the pipe's hot end to its cold end. The axial heat conducting velocity of the heat pipe depends on the value of the liquid's vaporization potent heat and the circulation speed between two forms of liquid and vapor. The axial heat conducting velocity of the heat pipe also is restrained by the type and quantity of the carrier material and the temperatures and pressures at which the heat pipe operates (it can not be too high).
The present superconductive heat transfer device is made of a thermal superconductive medium whose axial heat conduction is accomplished by the thermal superconductive mediums' molecules high speed movement upon being heated and activated. The present superconductive heat transfer device's heat conducting velocity is much higher than that of any metal bars or any convectional heat pipes of similar size, while its internal pressure is much lower than that of any convectional heat pipe of the same temperature."
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Well, well - if it isn't our old friends TTIC and the NPH heat columns again. Works pretty good if they make the copper heat column thick enough so the entire HS weighs 1058grams!
Uh, where in the patent writeup does it say the copper column needs to be thick for proper operation?
JMKE is reviewing this again in his next roundup, according to his recent posting.
Uh, where in the patent writeup does it say the copper column needs to be thick for proper operation?
JMKE is reviewing this again in his next roundup, according to his recent posting.
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i imagine you must really love this caseHoward wrote:Looks like something a fool would buy. Even if I had the money, I wouldn't buy something like that because it would be practically impossible to install. Maybe if you split up the radiator into 3 parts... Not only that, you'd need to design a different model for every motherboard.
http://techreport.com/onearticle.x/12611
i would love 2 see your design.
NeilBlanchard wrote:Hello,
Why would these be necessary for the north and south bridge chips? What about the heat transfer to the exterior heatsink? And what about the video chip?
Why would these be necessary for the north and south bridge chip
What about the heat transfer to the exterior heatsink?
what about it?
And what about the video chip?
passive?
not really. the b option.andaca wrote:Howard wrote:Looks like something a fool would buy. Even if I had the money, I wouldn't buy something like that because it would be practically impossible to install. Maybe if you split up the radiator into 3 parts... Not only that, you'd need to design a different model for every motherboard.
.
1) put the alu / fin side panel on the floor (pipes looking up)
2) put the ram / cpu / gpu on the mobo / thermal material
3) turn around the mobo and put it on top of the side panel
4) each heatpipe has it retention pins, just make sure they fit
5) screw each backplate
6) presto, put it inside your case.
how do you screw your mobo to the case? not my problem. removable backplate ?
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Thanks for not answering my questions.
Also, I knew I'd seen this before, in Noiseblocker Coolscrapers, page for their v.2 here.
Also, image:
And "option B", cheaper than Zalman or Thermalright solutions? Which solutions, exactly, would these be? And option B would still need to match the side panel holes with the locations of the components on a given board, which vary from board to board.
Also, I knew I'd seen this before, in Noiseblocker Coolscrapers, page for their v.2 here.
Also, image:
And "option B", cheaper than Zalman or Thermalright solutions? Which solutions, exactly, would these be? And option B would still need to match the side panel holes with the locations of the components on a given board, which vary from board to board.
The speed the heat travels is irrelevant. You can see that this is so because radiation transfers heat away at the speed of light, and yet it is not very effective at cooling computers. It's the thermal resistance which is important - the difference in temperature between the hot and cold ends necessary to cause 1W to be transferred.andaca wrote:Inorganic Medium Thermal Conductive Device. This heat conducting device greatly improved the heat conductive abilities of materials over their conventional state. Experimentation has shown this device capable of transferring heat along a sealed metal shell having a partial vacuum therein at a rate of 5,000 meters per second...
Those heatsinks are mostly for show, like the ridiculous heatspreaders on expensive RAM. Some chipsets can generate a fair bit of heat, but it's not that hard to cool.andaca wrote:
Why would these be necessary for the north and south bridge chip
[image of "rollercoaster" motherboard cooling]
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Are you just expecting everyone to praise your ingenuity blindly? If you want positive responses, build one of these things and impress us with how cool you can keep a computer without fans. Until then it's just a bunch of pretty pictures and technobabble. On the other hand, if you'd rather just surround yourself with yes-men, then go and post on those other sites.andaca wrote: this is not the only place i post. general response was mostly positive
except here.
and i say SHOW ME. SO FAR NO IDEAS- GOOD OR BAD - ONLY TEARS
andaca
Your statements make me think that you have never tried to assemble the above systems yourself. Try it and post back when you have fried the CPU .
Seriously, passive CPU cooling is just the first (and easiest) step on the way to a 0dBA system, you still need to think about silencing the hard drive(s) and designing a custom case with relocated vent holes. Without that there's not much sence in what you've done.
Your statements make me think that you have never tried to assemble the above systems yourself. Try it and post back when you have fried the CPU .
Seriously, passive CPU cooling is just the first (and easiest) step on the way to a 0dBA system, you still need to think about silencing the hard drive(s) and designing a custom case with relocated vent holes. Without that there's not much sence in what you've done.
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The heat output of the northbridge and especially the southbridge are tiny compared to the CPU. They do not need to use these fancy heatpipes -- the stock passive coolers are fine!andaca wrote:NeilBlanchard wrote:Hello,
Why would these be necessary for the north and south bridge chips? What about the heat transfer to the exterior heatsink? And what about the video chip?
Why would these be necessary for the north and south bridge chip
What about the heat transfer to the exterior heatsink?
what about it?
And what about the video chip?
passive?
All the heat from the CPU has to be transfered from the top of the heatpipe to the side of the case -- this is a second critical contact point that will be hard to manage correctly. When mounting the side panel, one must have thermal paste on the end of the heatpipe, and the case must make just enough pressure on the heatpipe to faciliate good heat transfer.
If one were to take a thermal image of the side of the case, how spread out would the heat be? This system would seem to offer far less effective cooling than just about any tower HS -- or even the stock heatsink used passively...
This system seems fussy and difficult -- and unnecessary.
The video card can sometimes put out more heat than the CPU.
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If you'd read your first link, you'd see that strontium occurs naturally in 4 non-radioactive isotopes. It's one of these that it makes sense to use, since the radioactive ones wouldn't be strontium after a while... As for beryllium, it's not a very nice substance but if you're gonna start counting carcenogenic substances in electronics you'll have a lot of work to do.
NeilBlanchard wrote:The heat output of the northbridge and especially the southbridge are tiny compared to the CPU. They do not need to use these fancy heatpipes -- the stock passive coolers are fine!andaca wrote:NeilBlanchard wrote:Hello,
Why would these be necessary for the north and south bridge chips? What about the heat transfer to the exterior heatsink? And what about the video chip?
Why would these be necessary for the north and south bridge chip
What about the heat transfer to the exterior heatsink?
what about it?
And what about the video chip?
passive?
All the heat from the CPU has to be transfered from the top of the heatpipe to the side of the case -- this is a second critical contact point that will be hard to manage correctly. When mounting the side panel, one must have thermal paste on the end of the heatpipe, and the case must make just enough pressure on the heatpipe to faciliate good heat transfer.
If one were to take a thermal image of the side of the case, how spread out would the heat be? This system would seem to offer far less effective cooling than just about any tower HS -- or even the stock heatsink used passively...
This system seems fussy and difficult -- and unnecessary.
The video card can sometimes put out more heat than the CPU.
A OR B ?
IMHO B IS DOABLE.
AGAIN. IF THIS IS POSSIBLE. MINE IS POSSIBLE. AND BETTER.
Last edited by andaca on Sun Jun 10, 2007 4:38 pm, edited 1 time in total.
Mr Evil wrote:Are you just expecting everyone to praise your ingenuity blindly? If you want positive responses, build one of these things and impress us with how cool you can keep a computer without fans. Until then it's just a bunch of pretty pictures and technobabble. On the other hand, if you'd rather just surround yourself with yes-men, then go and post on those other sites.andaca wrote: this is not the only place i post. general response was mostly positive
except here.
and i say SHOW ME. SO FAR NO IDEAS- GOOD OR BAD - ONLY TEARS
PRAISE? I DONT WANT IT / DESERVE IT.
I JUST WANTED TO SEE SOME CREATIVE INPUT/ IDEAS/ RADICAL
STUFF. I THOUGHT IT WOULD BE A FUNNY THREAD, BUT I GUESS I WAS WRONG. I CHOOSE TO SHARE MY IDEAS HERE BECAUSE I KNOW THERE IS A LOT OF TALENT IN THIS PLACE. IF YOU FEEL MY SOLUTION IS SHIT ITS ALL GOOD.
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